Copper and copper alloy wires exhibit excellent electrical and thermal conductivity, ductility, corrosion resistance, and workability. Depending on specific application requirements, options include pure copper wire, brass wire, bronze wire, phosphor bronze wire, cupronickel wire, and specialty copper alloy wires.
These products are ideally suited for electronics and electrical engineering, terminals, connectors, spring components, precision hardware, welding consumables, telecommunication equipment, automotive components, and industrial processing.

Extraction & Refining: Copper is extracted from ore and refined to eliminate impurities, producing high-purity copper cathodes.
Melting & Casting: Pure copper is melted and cast into large shapes (such as continuously cast rods), serving as the raw material for wire production.
Rolling (Rod Forming): The cast copper is processed through rolling mills into elongated, thicker wire rods.
Wire Drawing: The copper rod is pulled through a series of drawing dies with progressively decreasing diameters to gradually reduce its cross-section and elongate it into wire.
Annealing (Softening Treatment): The drawing process induces work hardening in the copper wire. A controlled annealing process restores its ductility and toughness, making it pliable and ready for installation.
Insulation (Optional): Depending on the end-use, the copper wire is coated with PVC, rubber, or an enamel film.
Quality Testing: Conductivity, tensile strength, dimensional accuracy (diameter tolerances), and surface quality are verified to ensure full compliance with industry standards (such as ASTM B3).

▪ Power & Energy: Building wire, power cables, and solar/wind power transmission systems. ▪ Electronics: Printed circuit boards (PCBs) and connectors in mobile devices and computers. ▪ Transportation: Powertrains and wiring harnesses in electric vehicles (EVs). ▪ Building & Construction: Water supply piping (with antimicrobial properties), roofing, and architectural design.
| Standard Code | Spec No. | Material No. | Mark |
|---|---|---|---|
| CNS | 10443 | C1100W | |
| GB | 5231 | T2 | |
| JIS | H3260 | C1100W | |
| DIN | 17677 | 2.009 | ECu-57 |
| CNS | 10443 | C1201W | |
| JIS | H3260 | C1201W | |
| DIN | 17677 | 2.007 | SW-Cu |
| (P)% | (Ni)% | (Pb)% | (Cu)% | (Zn)% | (Sn)% | (Fe)% | (Sb)% | (Bi)% | (O)% | (As)% | Cu+Ag | Impurity mixing |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| ≧ 99.9 | ||||||||||||
| ≦ 0.001 | ≦ 0.006 | ≦ 0.005 | ≦ 0.005 | ≦ 0.002 | ≦ 0.005 | ≦ 0.002 | ≦ 0.001 | ≦ 0.002 | ≦ 0.002 | ≧ 99.9 | ≦ 0.1 | |
| ≧ 99.9 | ||||||||||||
| ≧ 99.9 | 0.005~0.4 | |||||||||||
| 0.004~0.015 | ≦ 99.9 | |||||||||||
| 0.004~0.015 | ≦ 99.9 | |||||||||||
| 0.005~0.014 | ≧ 99.9 |